涂层薄膜应力及其纳米压痕检测（英文）

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Contents
1 Residual Stresses of Materials 1
1.1 Definition and Classification of Residual Stresses 1
1.2 Formation Mechanism of Residual Stress 2
1.2.1 Formation Mechanism of Macroscopic Residual Stress 2
1.2.2 Formation Mechanism of Microscopic Residual Stress 3
1.3 Effect of Residual Stress on Properties of Materials 3
1.3.1 Effect of Residual Stress on Fatigue Strength 3
1.3.2 Effect of Residual Stress on Brittle Failure 4
1.3.3 Effect of Residual Stress on Stress Corrosion Cracking 5
1.3.4 Effect of Residual Stress on Machining Precision and Dimension Stability 6
1.4 Test Methods of Residual Stress 7
1.4.1 Nondestructive Testing Methods 7
1.4.2 Destructive Testing Methods 13
References 17
2 Principle and Methods of Nanoindentation Test 21
2.1 Overview of Nanoindentation Technique 21
2.2 Measurement Principles of Hardness and Elastic Modulus 22
2.2.1 Oliver and Pharr Method (O&P Method) 22
2.2.2 Work-of-Indentation Method 25
2.2.3 Continuous Stiffness Measurement 27
2.3 Nanoindentation Testing Method 28
2.3.1 Indenter Types 28
2.3.2 Nanoindentation Instrumentation 30
2.4 Factors Affecting Nanoindentation Test Results 35
3 Theoretical Models for Measuring Residual Stress by Nanoindentation Method 37
3.1 Principle of Measuring Residual Stress by Nanoindentation Method 37
3.2 Effect of Residual Stress on Nanoindentation Parameters 37
3.2.1 Effect of Residual Stress on Load-Depth Curves 39
3.2.2 Effect of Residual Stress on Pile-up Deformation 42
3.2.3 Effect of Residual Stress on Contact Area 47
3.2.4 Effect of Residual Stress on Mechanical Properties 48
3.3 Models for Measuring Residual Stress 49
3.3.1 Suresh Model 51
3.3.2 Lee Model 59
3.3.3 Xu Model 62
3.3.4 Swadener Model 63
3.4 Indentation Fracture Technique 65
References 66
4 Application of Suresh and Lee Models in the Measurement of Residual Stress of Bulk Materials 69
4.1 Measurement of Residual Stresses in Single Crystal Copper 69
4.1.1 Pile-up of Single Crystal Copper 69
4.1.2 Model Construction of the Real Contact Area 70
4.1.3 Comparison of Different Methods for Calculating Contact Area 73
4.1.4 The Real Contact Area of the Single Crystal Copper 75
4.1.5 The Real Hardness of the Single Crystal Copper 76
4.1.6 Residual Stress Calculation of the Single Crystal Copper 78
4.2 Residual Stress Determination of 1045 Steel 79
4.2.1 Experimental 79
4.2.2 Load-Depth Curves of the 1045 Steel 80
4.2.3 Pile-up Deformation of the 1045 Steel 80
4.2.4 The Real Hardness of the 1045 Steel 83
4.2.5 Calculation of Residual Stresses of the 1045 Steel 87
References 97
5 Application of Suresh and Lee Models in the Measurement of Residual Stress of Coatings 99
5.1 Residual Stresses of Fe-Based Laser Cladding Coatings 99
5.1.1 Preparation of Fe-Based Laser Cladding Coatings 99
5.1.2 Microstructures of Fe-Based Laser Cladding Coatings 101
5.1.3 Residual Stress Analysis of Fe-Based Laser Cladding Coatings 105
5.2 Residual Stress of Fe-Based Coatings Prepared by Supersonic Plasma Spraying 114
5.2.1 Preparation of Sprayed Fe-Based Coatings 114
5.2.2 Microstructure of Sprayed Fe-Based Coatings 115
5.2.3 Residual Stress Analysis of Sprayed Fe-Based Coatings 119
5.3 Residual Stress of Plasma Cladding Coatings 129
5.3.1 Preparation of Plasma Cladding Coatings 129
5.3.2 Microstructure of Plasma Cladding Coatings 130
5.3.3 Mechanical Properties of Plasma Cladding Coatings 132
5.3.4 Residual Stress Analysis of Plasma Cladding Coatings . 134
5.4 Residual Stress of n-Al203/Ni Composite Brush Plating Coatings 138
5.4.1 Preparation of n-A^C^/Ni Composite Brush Plating Coatings 139
5.4.2 Microstructure of n-Al203/Ni Composite Brush Plating Coatings 139
5.4.3 Mechanical Properties of n-Al203/Ni Composite Brush Plating Coatings 141
5.4.4 Residual Stress Analysis of n-Al203/Ni Composite Brush Plating Coatings 143
References 145
6 Application of Suresh and Lee Models in the Measurement of Residual Stress of Films 147
6.1 Residual Stress of Magnetron Sputtering Cu Films 147
6.1.1 Preparation of Magnetron Sputtering Cu Films 147
6.1.2 Microstructure of Magnetron Sputtering Cu Films 148
6.1.3 Mechanical Properties of Magnetron Sputtering Cu Films 152
6.1.4 Residual Stress Analysis of Magnetron Sputtering Cu Films 152
6.2 Residual Stress of Magnetron Sputtering Ti Films 156
6.2.1 Preparation and Characterization of Magnetron Sputtering Ti Films 156
6.2.2 Effects of Process Parameters on the Hardness and Elastic Modulus of Ti Films 166
6.2.3 Effect of Process Parameters on the Residual Stress of Ti Films 172
6.3 Residual Stress of TiN Films and Ti/TiN Multilayer Films 178
6.3.1 Preparation and Characterization of TiN Films 178
6.3.2 Preparation and Characterization of Ti/TiN Multilayer Films 181
6.3.3 Hardness and Elastic Modulus of T